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 INTEGRATED CIRCUITS
DATA SHEET
TZA1000 QIC read-write amplifier
Preliminary specification Supersedes data of 1998 Mar 11 File under Integrated Circuits, IC01 1998 Mar 17
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
FEATURES * 3-wire serial interface for programming * On-chip Digital-to-Analog Converters (DAC) for: - MR (Magneto Resistive) sense bias current - MR DC bias current - Write current * Low noise differential input stage: typically 0.65 nV/Hz (Zi = 0 ) * Magnetic feedback circuit to handle large output signals * MR DC bias current circuit * Very fast write current rise and fall times with near rail-to-rail voltage swing * Maximum write current of 100 mA: ready for high coercivity tape * Low noise read amplifier for reading track height servo signals with the write coil * Very few external components required * On board registers for easy format or bit rate selection * Fast read-after-write recovery time * Test circuit for yoke-type heads * Switchable differentiator for yoke-type heads, with programmable cut-off frequencies * Anti-aliasing low-pass filter, with programmable cut-off frequencies * AGC (Automatic Gain Control) options: internally (digitally) controlled, externally controlled or fixed gain * Hold input for fast AGC freeze GENERAL DESCRIPTION
TZA1000
* Input for fast reader/writer (track height servo) signal selection * Power fail detection on both 5 and 12 V lines (status can be read from the read register) * Write unsafe detection * Provides an accurate reference voltage (for AD conversion) * Very simple interconnection with the SZA1000 QIC digital equalizer * +5 V 10% and +12 V 10% supply voltages * Low power standby, active and test modes. RELATED DOCUMENTS * SZA1000 QIC digital equalizer data sheet * Application notes for TZA1000 and SZA1000. Both are available from Philips Semiconductors.
The TZA1000 is a single-chip read-write amplifier for single-channel QIC (Quarter Inch Cartridge) systems with MR heads. It can be used with both SIG (Sensor in Gap)and yoke-type MR heads and is designed to be used in conjunction with the Philips SZA1000 digital equalizer IC (although it can also function as a stand alone unit). This combination is flexible enough to be used with all popular tape backup formats including QIC 80, QIC 3010, QIC 3020, QIC 3080, QIC 5010, Travan 1, Travan 2, Travan 3 and Travan 4 and to be forward compatible with their single channel successors.
QUICK REFERENCE DATA SYMBOL VDD1 VDD2 VDD3 IDD1; IDD2 PARAMETER read circuit supply voltage FB and write circuit supply voltage sense current circuit supply voltage read/FB and write circuit supply current Read mode Write mode IDD3 Vn(i)(eq) fclk Tamb Tj Rth(j-a) 1998 Mar 17 sense current circuit supply current equivalent input noise voltage clock frequency recommended operating temperature recommended junction temperature thermal resistance from junction to ambient 2 in free air Iwrite = 30 mA Isense = 16 mA Zsource = 0 - - 15.0 - - 0 0 - 69 105 16.2 0.65 - - - 66 - - 19.0 0.8 24 70 125 - mA mA mA nV/Hz MHz C C K/W CONDITIONS MIN. 4.5 4.5 10.8 5 5 12 TYP. MAX. 5.5 5.5 13.2 V V V UNIT
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
ORDERING INFORMATION TYPE NUMBER TZA1000 PACKAGE NAME SO24 DESCRIPTION plastic small outline package; 24 leads; body width 7.5 mm
TZA1000
VERSION SOT137-1
1998 Mar 17
3
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12 V VDD3 9 ISENSE 8 SENSE CURRENT SOURCE 0 to 30 mA DAC (I) 7+1-bit SIG/ YOKE VARIABLE GAIN 10 to 25 dB 4 to 19 dB 19 OUTA HPF 1 to 10 MHz 22 dB LPF 1 to 10 MHz 0 dB 18 OUTB 13 -10 dB -4 dB AGC CONTROL CIRCUIT LEVEL DETECTOR INTERNAL REFERENCE VOLTAGES INA 6 MR HEAD PREAMP INB 7 4/34/40 dB HOLD BIASA 24 BIAS (YOKE) BIASB 23 13 dB BIAS + FB TEST GEN DAC (V) SERVO PREAMP 5-bit
BLOCK DIAGRAM
Philips Semiconductors
handbook, full pagewidth
QIC read-write amplifier
5 17
VDD1 5 V VDD2 5 V
BANDGAP REF
20
Vref
4
WRITER
15 CONTROL CIRCUIT 12 10 11
CLK SDIO SCLK SDEN
TZA1000
WX WY
1 3
WRITE CIRCUIT 10 to 100 mA
DAC (I)
WRITE UNSAFE DETECTOR 7-bit
VDD3 VDD1
POWER FAIL DETECTOR
22
RESET
CURRENT REF TOGGLE WDI to WD 14 WGATE 4 WD 2 VSS1 16
21
Iref
Preliminary specification
MGG660
TZA1000
VSS2
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
PINNING SYMBOL WX VSS1 WY WD VDD1 INA INB ISENSE VDD3 SCLK SDEN SDIO HOLD WGATE CLK VSS2 VDD2 OUTB OUTA Vref Iref RESET BIASB BIASA Notes 1. Pin type abbreviations: O = output, I = input, P = power supply. 2. Digital inputs: LOW: <0.3VDD ; HIGH: >0.7VDD. 3. Use only for connecting current reference resistor. See Chapter "Equivalent pin circuits" for the I/O configuration of the analog pins. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION write current to head large signal ground write current to head write data large signal +5 V read signal from MR read signal from MR sense current for MR +12 V for sense current supply serial interface clock serial interface enable serial interface data I/O hold AGC; active LOW write gate; active LOW clock input small signal ground small signal +5 V output to equalizer output to equalizer 2 V reference output current reference resistor reset for microcontroller; active LOW TYPE(1) O P O I(2) P I I O P I(2) I(2) I/O I(2) I(2) I(2) P P O O O note 3 O Fig.2 Pin configuration.
handbook, halfpage
TZA1000
WX 1 VSS1 2 WY 3 WD 4 VDD1 5 INA 6
24 BIASA 23 BIASB 22 RESET 21 Iref 20 Vref 19 OUTA
TZA1000
INB 7 ISENSE 8 VDD3 9 SCLK 10 SDEN 11 SDIO 12
MGG659
18 OUTB 17 VDD2 16 VSS2 15 CLK 14 WGATE 13 HOLD
bias current for yoke heads O bias current for yoke heads O
1998 Mar 17
5
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
FUNCTIONAL DESCRIPTION The preamplifier The gain and dynamic range of the symmetrical low noise preamplifier can be varied to accommodate a wide variation in input signal amplitude (see Table 11). The 40 dB and 34 dB gain settings are provided for normal use. The 40 dB setting offers the lowest noise figure. The 4 dB gain setting is intended for IC testing only. The servo preamplifier This low noise preamplifier can be used for reading signals, such as QIC 3095 (Travan 4) servo signals, via the recording head write coil. Servo mode is selected either by resetting bits AI0 and AI1 in the control register (see Table 9) or by means of the HOLD pin (the HSM control bit must be set when HOLD goes LOW; see Table 7). When servo mode is selected, the maximum total gain is set automatically regardless of, and without overwriting, gain settings. Fast switch-over from read mode to servo mode can thus be achieved without having to alter register values. Variable gain stage and AGC The input to the variable gain stage can be switched to the preamplifier output, to the output of the bias/FB (Feed Back) circuit, or to the servo preamplifier output. When using magnetic feedback, the bias/FB circuit output should be selected (see Table 9). The AGC range is 15 dB. The gain is programmable in 1 dB steps (see Table 12). If the output signal is too small, a digital control circuit will increase the gain from minimum to maximum in approximately 10 ms. If the output signal is too large, the gain will be reduced from maximum to minimum in approximately 0.2 ms. These values assume a 24 MHz clock frequency. The upper limit of the gain control range can be extended by 6 dB by setting the G6DB bit in the control register via the serial interface (see Table 13). The AGC is frozen while the HOLD input is LOW, the TZA1000 is writing, or the IC is in servo mode. The AGC can be operated internally, running on the CLK clock signal on pin 15 (HOLD HIGH and GFXD LOW; see Table 12), or externally by means of a software algorithm (GFXD HIGH). When operated externally, either the DN bit in the status read register (see Table 17) or the level measurement in the digital equalizer IC (SZA1000) can be used as input to the algorithm.
TZA1000
The AGC will maintain outputs OUTA and OUTB at 1.1 V (p-p). Additional level adjustment points are provided by the 34 or 40 dB preamplifier gain switch (see Table 11) and the -10 or -4 dB bias output attenuation switch (see Table 9). High-pass filter The HPF (High-Pass Filter) is used to differentiate yoke-type head signals. It is followed by an additional gain stage (21 dB). The HPF cut-off frequency is coupled to the cut-off frequency of the LPF (Low-Pass Filter), and is selectable in 4 steps: 1, 2, 4 and 10 MHz (see Table 2). The HPF can be bypassed for SIG heads (see Table 8). Low-pass filter The second order low-pass filter is used to attenuate high frequency noise above the signal bandwidth, mainly to provide anti-aliasing filtering for the A/D converter in the digital equalizer. The cut-off frequency of the LPF is selectable in 4 steps: 1, 2, 4 and 10 MHz (see Table 2). Sense current circuit The sense current circuit is a programmable current source, operating from the 12 V supply (VDD3). It can be programmed to supply a current between 0 and 15 mA, with 7-bit resolution. The current range can be doubled, then ranging from 0 to 30 mA, by setting the SDB bit in the control register (see Table 15). The sense current circuit can be disabled by resetting the ENS bit (see Table 4). This is the only circuit on the IC that uses the 12 V supply. The output must be decoupled with a low impedance capacitor (10 F recommended) to reduce noise coupling into the head. For the current source circuit to operate correctly, the voltage difference between VDD3 (pin 9) and ISENSE (pin 8) must be at least 1.6 V.
1998 Mar 17
6
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
Bias and magnetic feedback circuit This circuit can be used to generate AC and DC bias currents (for a yoke-type MR head, for instance). The DC bias output voltage is programmable between 0 and 1.4 V, with 5-bit resolution (see Table 3). The DC current generated is this voltage divided by the total bias resistance (head coil + total series resistance). The AC signal input to the circuit can be switched to the preamplifier output (see Table 10). In this way, magnetic feedback inside the head can be achieved. This limits head distortion, and prevents head saturation from large tape signals, like QIC 80 recordings. The open loop gain of the feedback loop depends on head sensitivity, the selected sense current (see Table 15), and the selected preamplifier gain (see Table 11). The values of the external resistors connected in series with the bias conductor can be used to set the gain. For loop stability at high frequencies, the bandwidth of the magnetic feedback amplifier is limited to 5 MHz. In closed loop mode, the effective cut-off frequency for the playback signals will increase with the feedback factor. For this reason the read signal can be taken from the output of the bias circuit. To prevent loop instability at low frequencies, the preamplifier input capacitors should be chosen such that the cut-off frequency at that point is well above, or well below, the internal cut-off frequency of the AC coupling between the preamplifier and the bias circuit (input impedance of the preamplifier is typically 2 k). The maximum (peak AC) current that the bias circuit can deliver can be adjusted to achieve an optimum balance between required current range and power consumption (see Table 3). The AC circuit is switched off when the TZA1000 is writing, and the maximum current is switched to 10 mA. This limits power dissipation during writing. Test generator This circuit generates a test signal with a frequency 116 that of the signal at the CLK input (pin 15). By switching the AC input of the bias circuit to the internal test generator (see Table 10), the read channel can be tested. The differential output value is typically 100 mV (p-p). This facility can also be used to adjust the DC bias voltage while monitoring the signal at the read element in the head. The optimum DC bias level setting is just before the output from the read head reaches its peak. Write circuit
TZA1000
The write circuit is a differential current source that can generate a near rail-to-rail output voltage to get the shortest current transition time. Writing is enabled when WGATE is LOW. The polarity of the current depends on the WD input pin. The WDM bit in the control register determines the write signal mode: WD (Non-Return to Zero) or WDI (Return to Zero; see Table 14). When WDI mode is selected, the polarity of the write current is reversed at every falling edge of the WD input. When WD mode is selected, the polarity of the write current is reversed when the polarity of WD changes. The write current is programmable between 0 and 125 mA, with 7-bit resolution (see Table 14). The IC is specified for a write current of up to 100 mA. Overshoot caused by an inductive load can be minimized by means of a single external resister local to the IC. Write unsafe detector The write unsafe detector will detect an open write coil, or one shorted to ground. The circuit is enabled only while the TZA1000 is writing. A resistance to GND or VDD of less than 10 , or a series resistance greater that about 300 , will be detected (these values are write-current dependant). If an error occurs, the WUS status bit is set. This bit can be read via the serial interface. The WUS bit will remain set until the status byte is read. Power fail detector The power fail detector will detect a low voltage on the 5 V (VDD1) or 12 V (VDD3) supply lines. The thresholds are 3.75 V for VDD1 and 9 V for VDD3. A power failure is detected if the voltage is below the threshold for 1 s or longer. If a 5 V power failure occurs, the status bit PF5 is set. If a 12 V power failure occurs, the status bit PF12 is set. These bits can be read via the serial interface, and will remain HIGH until the status byte is read. When a 5 V power failure occurs, the RESET output goes LOW and the write circuit is disabled (in addition to PF5 being set). The RESET output has an internal 18 k pull down resistor to guarantee a LOW level at the output even when a power failure occurs. During normal operation, the RESET pin should not be held LOW by an external circuit, since this will switch the IC into test mode.
1998 Mar 17
7
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
DACs There are 3 internal DACs: 1. The Sense DAC: current DAC; 7-bit resolution 2. The Write DAC: current DAC; 7-bit resolution 3. The Bias DAC: voltage DAC; 5-bit resolution. The Sense and Write DAC current settings are a function of the reference current Iref (at the Iref pin). Iref is multiplied by a 7-bit factor: S0 to S6 for the sense DAC, W0 to W6 for the write DAC (see Tables 14 and 15). If the resistance between Iref and GND is increased (or decreased), the DAC output currents will be decreased (or increased) by the same factor. In this way, the DAC output current ranges can be adjusted. The current values specified, and the equations used to calculate Sense and Write currents (see Tables 14 and 15), are for a 430 resistance between Iref and GND. This resistance can be varied between 250 and 1 k, giving a 2 x DAC modification range. For reasons of noise and stability, the voltage at the Iref pin should not be used in any other part of the circuit. Clock handling The TZA1000 has 2 clock inputs: CLK: the general clock input, pin 15
TZA1000
SCLK: the serial interface clock input, pin 10. CLK is used for status register read and write cycle timing and for operating the internal AGC. When the AGC is not being used and serial communications are not active, CLK may be switched off. This can help reduce crosstalk on the printed circuit board. When accessing the status register, the CLK frequency must be at least 16 x SCLK frequency. It is recommended that the 24 MHz clock supplied by the SZA1000 be used directly. Serial interface The 3 wire serial interface recognizes 8-bit addresses and 8-bit data. To read data from the status register, hex address FF must be transmitted. The IC will then respond with the contents of the 8-bit status register.
1998 Mar 17
8
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andbook, full pagewidth
1998 Mar 17
SDEN SCLK SDIO A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3
Philips Semiconductors
QIC read-write amplifier
WRITE SETTINGS
D2
D1
D0
3-STATE
READ STATUS SDEN
9
SCLK SDIO A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
3-STATE
MGG661
ADDRESS AND DATA FROM MICROCONTROLLER
DATA FROM IC
Preliminary specification
TZA1000
Fig.3 Timing diagrams.
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
CONTROL REGISTER The control register contains six 8-bit entries configured as shown in Table 1. Table 1 Control register settings D7 - HSM - - WDM SDB D6 FC1 DIFF - - W6 S6 D5 FC0 AI1 G6DB - W5 S5 D4 ENFB1 AI0 GFXD B4 W4 S4 D3 ENFB0 FBI1 G3 B3 W3 S3 D2 ENS FBI0 G2 B2 W2 S2 D1
TZA1000
ADDRESS 0 1 2 3 4 5 Control bits
D0 ENREF PG0 G0 B0 W0 S0
ENRD PG1 G1 B1 W1 S1
Control bit functions are detailed in Tables 2 to 17. Table 2 HPF and LPF cut-off frequency FC1 0 0 1 1 Table 3 Bias current settings; note 1 ENFB1 0 0 1 1 Note 1. Control bits B0 to B4 make up a 5-bit number between 0 and 31. The DC bias voltage between BIASA and BIASB (pins 23 and 24) is B x 45 mV. BIASA is positive with respect to BIASB. Table 4 Sense current circuit SENSE CURRENT CIRCUIT disabled enabled Read circuits (excluding preamplifiers) READ CIRCUITS disabled enabled 10 Table 7 Table 6 Internal reference voltages INTERNAL REF. VOLTAGES disabled enabled HOLD pin function FUNCTION AGC hold on or off select servo or data preamplifier ENFB0 0 1 0 1 BIAS CIRCUIT off on on on Ibias(min) 0 -10 mA 0 -10 mA Ibias(max) 0 +10 mA +10 mA +20 mA FC0 0 1 0 1 FREQUENCY 1 MHz 2 MHz 4 MHz 10 MHz
ENS 0 1 Table 5
ENREF 0 1
ENRD 0 1 1998 Mar 17
HSM 0 1
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
Table 8 HPF circuit DIFF 0 1 Table 9 Variable gain circuit input select HSM 0 0 0 0 1 1 1 1 1 Table 10 Bias circuit input FBI1 0 0 1 1 FBI0 0 1 0 1 INPUT no signal preamplifier test generator preamplifier HOLD X X X X 1 1 1 1 0 AI1 0 0 1 1 0 0 1 1 X AI0 0 1 0 1 0 1 0 1 X Table 11 Preamplifier gain PG1 0 0 1 1 PG0 0 1 0 1 INPUT HPF CIRCUIT bypassed on
TZA1000
servo preamplifier preamplifier bias output -10 dB bias output -4 dB servo preamplifier preamplifier bias output -10 dB bias output -4 dB servo preamplifier
GAIN 0 34 dB 4 dB 40 dB
Table 12 AGC setting HSM 0 0 1 1 X Note 1. Control bits G0 to G3 make up a 4-bit number used to program the gain in 1 dB steps (from 4 to 19 dB if G6DB is 0, from 10 to 25 dB if G6DB is 1; see Table 13). Table 13 Variable gain circuit range select G6DB 0 1 RANGE 4 to 19 dB 10 to 25 dB HOLD 1 0 1 0 X GFXD 0 0 0 0 1 AGC on frozen at last value on no AGC at servo mode: maximum gain off, gain set by G0 to G3; note 1
1998 Mar 17
11
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
Table 14 Write mode select; note 1 WDM 0 1 Note 1. Control bits W0 to W6 make up a 7-bit number between 0 and 127. Write current is 125 x ( W + 1 ) ------------------------------------- mA (Rref = 430 ). 128 Table 15 Sense current range select; note 1 SDB 0 1 Note CURRENT 0 to 15 mA 0 to 30 mA EXPECTED INPUT SIGNAL WDI WD
TZA1000
FUNCTION on bypassed
15 x ( S + 1 ) 1. Control bits S0 to S6 make up a 7-bit number between 0 and 127. Sense current is -------------------------------- mA when SDB = 0 128 30 x ( S + 1 ) and -------------------------------- mA when SDB = 1 (Rref = 430 ). 128 Status A status byte, located at address FF, contains the following status bits: Table 16 Status byte settings ADDRESS FF Notes 1. Actual gain. Allows the gain to be determined while the AGC is on. 2. This bit can be used for microcontroller gain control, with the AGC off (see Table 17). 3. Power failure detected on the +5 V supply (VDD1). 4. Write unsafe detected: head open or short circuited. 5. Power failure detected on the +12 V supply (VDD3). Table 17 Sense current range select. DN 0 1 GAIN can be increased can be decreased D7 AG3(1) D6 AG2(1) D5 AG1(1) D4 AG0(1) D3 DN(2) D2 PF5(3) D1 WUS(4) D0 PF12(5)
1998 Mar 17
12
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD1 VDD2 VDD3 IDD1 IDD2 IDD3 II(n) Ptot Tamb Tj Tstg VES(HB) VES(MM) Notes PARAMETER read circuit supply voltage FB and write circuit supply voltage sense current circuit supply voltage read circuit supply current FB and write circuit supply current sense current circuit supply current input current on remaining pins maximum total power dissipation ambient temperature junction temperature storage temperature electrostatic handling: human body model electrostatic handling: machine model note 2 note 3 note 1 CONDITIONS MIN. -0.3 -0.3 -0.3 - - - -10 - 0 0 -50 -1000 -200
TZA1000
MAX. +5.5 +5.5 +13.2 150 35 35 +10 1000 +70 +135 +150 +1000 +200 V V V
UNIT
mA mA mA mA mW C C C V V
1. Maximum permissible ambient temperature is dependent on internal dissipation. Tj is the discriminating factor. Tj = (Rth(j-a) x Ptot) + Tamb, where Ptot is the total dissipation in the package. 2. Equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. 3. Equivalent to discharging a 200 pF capacitor through a 25 series resistor and a 2.5 H series inductance. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient in free air VALUE 66 UNIT K/W
QUALITY SPECIFICATION In accordance with "SNW-FQ-611E".
1998 Mar 17
13
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
CHARACTERISTICS VDD1 = VDD2 = 5 V 5%; VDD3 = 12 V 5%; Tamb = 25 C 5%; unless otherwise specified. SYMBOL VDD1 VDD2 VDD3 IDD1 PARAMETER read circuit supply voltage FB and write circuit supply voltage sense current circuit supply voltage read circuit supply current Rd Wr IDD2 FB and write circuit supply current Rd Wr IDD3 Vref I20 sense current circuit supply current reference voltage current on pin 20 (Vref) source sink V21 Iref Read section Gv(pa) preamplifier voltage gain PG1 = 1; PG0 = 1 PG1 = 0; PG0 = 1 PG1 = 1; PG0 = 0 Gv(agc) Gv(agc) Gv(yoke) fcoupling f-3dB(cutoff)(HPF) AGC amplifier voltage gain AGC voltage gain control range yoke amplifier voltage gain -3 dB AC coupling frequency HPF -3 dB cut-off frequency input to output FC1 = FC1 = 0 FC1 = 0; FC1 = 1 FC1 = 1; FC1 = 0 FC1 =FC1 = 1 f-3dB(cutoff)(LPF) LPF -3 dB cut-off frequency FC1 = FC1 = 0 FC1 = 0; FC1 = 1 FC1 = 1; FC1 = 0 FC1 =FC1 = 1 Vn(i)(eq)(preamp) equivalent input noise voltage: preamplifier Zsource = 0 G6DB = 1; G = 15; note 1 note 2 37 32 3 23 - 19 2 - - - - - - - - - 38.6 32.7 4.1 24.4 22 21 5 1.0 2.0 4.7 10 1.1 2 4.3 11 0.65 41 34 6 26 - 23 10 - - - - - - - - voltage at pin 21 (Iref) reference current (pin 21) - - 1.2 1 - - 1.3 3 Isense = 16 mA pin 20; IO = 0 to 3 mA max gain - - 15.0 1.9 38 36 16.2 2.0 - - Ibias = -10 to +10 mA Iwrite = 30 mA - - 31 70 - - CONDITIONS MIN. 4.5 4.5 10.8 TYP. 5.0 5.0 12.0
TZA1000
MAX. 5.5 5.5 13.2
UNIT V V V
mA mA
mA mA mA V mA A V mA
19.0 2.1 3.0 50 1.4 5
dB dB dB dB dB dB kHz MHz MHz MHz MHz MHz MHz MHz MHz nV/Hz
0.8
1998 Mar 17
14
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
TZA1000
SYMBOL Zi VI(6,7) THD Gv(servo) Vn(i)(eq)(servo) VI(1,3)) Isense Isense(max) VVDD3-ISENSE
PARAMETER input impedance DC input voltage; pins 6 and 7 total harmonic distortion
CONDITIONS 1
MIN. 1.2
TYP. 1.84 1.3 - 66 1.8 2.5 15.2 - - 4
MAX. 1.4 -40 70 2.8 2.6 15.8 - 13.2
UNIT k V dB dB nV/Hz V mA mA V
at 34 and 40 dB gain settings; Vo(p-p) = 1 V Zsource = 0
- 62 - 2.4
servo preamplifier voltage gain WX-WY to output equivalent input noise voltage: servo pre-amp DC input voltage pins 1 and 3 sense current maximum sense current voltage difference between VDD3 and ISENSE (pins 9 and 8) sense DAC resolution output impedance of sense current source FB amplifier voltage gain -3 dB bandwidth of FB amplifier -3 dB AC coupling of FB amplifier bias current amplitude (peak-to-peak) f = 1 kHz; Io(sen) = 16 mA Rref = 430 ; S = 64; note 3 all conditions; note 4
14.6 33 1.6
RESDAC(SENSE) Zo(sense) Gv(FB) B(-3dB) fcoupling(FBamp) Ibias
- 10 11.5 - - ENFB1 = 0; ENFB0 = 1 -10 ENFB1 = 1; ENFB0 = 0 0 ENFB1 = ENFB0 = 1 -10 1.6 1.4 B = 0; see Table 3 B = 31; see Table 3; bias load 88
7 - 13 5 3 - - - 1.8 1.52
- - 14.5 - - +10 +9 +20 2.0 1.6
bits k dB MHz kHz mA mA mA V V
VO(23,24) VBIASA-BIASB
DC voltage level of FB outputs (pins 23 and 24) voltage difference between BIASA and BIASB (pins 23 and 24) at maximum DC bias voltage bias DAC resolution read amplifier DC output voltage (pins 18 and 19) read amplifier DC offset voltage (voltage change at pins 18 and 19) output voltage (RMS value; pins 18 and 19) guaranteed output current lower AGC detection voltage level at OUTB upper AGC detection voltage level at OUTB
RESDAC(BIAS) VO(18,19) VOO(18,19)
- 2.4 -
5 2.5 -
- 2.6 100
bits V mV
Vo(rms)(18,19) Io VO(AGCL) VO(AGCH)
- 1.5 2.15 2.75
- - 2.2 2.8
0.5 - 2.25 2.85
V mA V V
1998 Mar 17
15
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
TZA1000
SYMBOL Vhys(AGC) BAGC fclk Write section Iwrite
PARAMETER hysteresis in AGC detection level AGC bandwidth operational clock
CONDITIONS
MIN. 65 -
TYP. 75 1.5 24
MAX. 85 - 24
UNIT mV MHz MHz
note 5 Rhead = 10 ; Rref = 430; 0-peak; W = 32; note 6 Rhead = 10 ; note 7 Iwrite = 30 mA; note 8 resistive load, 10 Rhead = 10 ; Lhead = 200 nH
0
write current
27.3
28.8
30.3
mA
Iwrite(max) Iwrite tt(iwrite)(Rload)
maximum write current difference between positive and negative write currents write current transition time resistive load head load
60 -
80 0
- 5
mA %
- - 3 - -
4 6 - 0.2 10 0 - - - -
- 12 - - - 1 - - 10 -
ns ns V s s ns ns ns
Vo(p-p)(1,3) tR-W tW-R tWD tWDIH tWDIL Rdet(WUS)
output voltage swing (peak-to-peak value) read to write time write to read time WD pulse asymmetry WDI pulse time HIGH WDI pulse time LOW WUS detection resistance level in WDI mode; note 9
- 5 5
short circuited to VDD or - VSS; Iwrite = 30 mA open; Iwrite = 30 mA 150
Notes 1. G is a 4-bit number contained in control bits G0 to G3 (see Table 12). 2. 6 dB step via a fixed setting, and 16 dB (in 1 dB steps) via AGC control. 3. S is a 7-bit number contained in control bits S0 to S6 (see Table 15). 4. The TZA1000 is guaranteed to operate reliably with sense currents of up to 33 mA. 5. The operational clock frequency (pin 15) must be >16 times higher the SCLK frequency to ensure reliable serial transfer. 6. W is a 7-bit number contained in control bits W0 to W6 (see Table 14). A more accurate calculation of the write current would be given by: Ic = It - 0.003 x It2, where It = 125 (W + 1) / 128, It the target current and Ic the write current. 7. The TZA1000 is guaranteed to supply a write current of up to 60 mA. 8. 10 to 90% of a total current reversal. 9. Difference between negative-to-positive and positive-to-negative current slopes.
1998 Mar 17
16
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
EQUIVALENT PIN CIRCUITS PIN 1 DESCRIPTION write output stage EQUIVALENT PIN CIRCUIT
VDD
TZA1000
1 WX
MGG662
3
write output stage
VDD
3 WY
MGG663
1,3,20
servo input configuration
WX 1 700 2.5 V Vref 20 3 700 WY
MGG664
6,7,20
input configuration
INA 6 5 k 1.4 V Vref 20
MGG665
7 INB 5 k
8
sense output configuration
12 V 50
8
MGG666
ISENSE
1998 Mar 17
17
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
TZA1000
PIN 10
DESCRIPTION digital input configuration
EQUIVALENT PIN CIRCUIT
VDD
SCLK 10
MGG667
11
digital input configuration
VDD
SDEN 11
MGG668
13
digital input configuration
VDD
HOLD 13
MGG669
14
digital input configuration
VDD
WGATE 14
MGG670
15
digital input configuration
VDD
CLK 15
MGG671
1998 Mar 17
18
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
TZA1000
PIN 18
DESCRIPTION output configuration
EQUIVALENT PIN CIRCUIT
VDD 25
18 OUTB 2.3 mA DC: 2.5 V
MGG672
19
output configuration
VDD 25
19 OUTA 2.3 mA DC: 2.5 V
MGG673
20
Vref output configuration
VDD 50
20 Vref 6 k
MGG674
22
reset output configuration
VDD
22 RESET 18 k
MGG675
1998 Mar 17
19
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
PACKAGE OUTLINE SO24: plastic small outline package; 24 leads; body width 7.5 mm
TZA1000
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1998 Mar 17
20
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
TZA1000
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Mar 17
21
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TZA1000
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Mar 17
22
Philips Semiconductors
Preliminary specification
QIC read-write amplifier
NOTES
TZA1000
1998 Mar 17
23
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
Internet: http://www.semiconductors.philips.com
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/00/02/pp24
Date of release: 1998 Mar 17
Document order number:
9397 750 03524


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